Electrical signal integrity considerations for
HP BladeSystem
technology brief
Introduction......................................................................................................................................... 2
What is signal integrity ........................................................................................................................ 2
Challenges.......................................................................................................................................... 4
Significant factors affecting signal integrity ............................................................................................. 6
Dielectric losses ............................................................................................................................... 6
Skin effect ....................................................................................................................................... 6
Impedance discontinuities ................................................................................................................. 6
Stubs .............................................................................................................................................. 7
Crosstalk......................................................................................................................................... 8
Design goals....................................................................................................................................... 9
Target fabrics ................................................................................................................................10
Infrastructure architecture ................................................................................................................ 10
Implementation.................................................................................................................................. 11
Specification library ....................................................................................................................... 12
Board trace lengths ........................................................................................................................ 12
Board layout and materials ............................................................................................................. 12
Summary .......................................................................................................................................... 15
For more information.......................................................................................................................... 16
Call to action .................................................................................................................................... 16