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Hewlett-Packard BladeSystem c3000 Technology Brief

Download Technology brief of HP BladeSystem c3000 Enclosure, Server for Free or View it Online on All-Guides.com.

Brand: HP

Category: Enclosure , Server

Type: Technology brief for HP BladeSystem c3000

Pages: 28 (2.53 Mb)

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Page 1
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HP BladeSystem c3000 Enclosure technologies 

technology brief

 

Abstract.............................................................................................................................................. 2

 

Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 2

 

HP Thermal Logic technologies .............................................................................................................. 4

 

Active Cool fans .............................................................................................................................. 5

 

HP PARSEC architecture.................................................................................................................... 6

 

Thermal Logic for the server blade and enclosure................................................................................. 7

 

Power supplies and enclosure power subsystem................................................................................... 8

 

HP BladeSystem Power Sizer ......................................................................................................... 9

 

Pooled power ............................................................................................................................ 10

 

Dynamic Power Saver mode ........................................................................................................ 11

 

Power Regulator......................................................................................................................... 11

 

Power Capping for each server blade........................................................................................... 11

 

Interconnect options and infrastructure.................................................................................................. 12

 

Fabric connectivity and port mapping............................................................................................... 13

 

Virtual Connect.............................................................................................................................. 16

 

Enclosure-based DVD ROM................................................................................................................. 17

 

Onboard Administrator ...................................................................................................................... 17

 

Insight Display ............................................................................................................................... 19

 

Web GUI...................................................................................................................................... 20

 

Command-line interface .................................................................................................................. 20

 

Onboard Administrator cabling ....................................................................................................... 20

 

Enclosure link cabling..................................................................................................................... 20

 

Recommendations.............................................................................................................................. 21

 

Summary .......................................................................................................................................... 21

 

Appendix A. Acronyms in text............................................................................................................. 22

 

Appendix B. Fan, power supply, and device bay population guidelines................................................... 23

 

For more information.......................................................................................................................... 28

 

Call to action .................................................................................................................................... 28