Hewlett-Packard BladeSystem c3000 Technology Brief

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Brand: HP

Category: Enclosure , Server

Type: Technology brief for HP BladeSystem c3000

Pages: 28 (2.53 Mb)

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Figure 10. Traces on the signal midplane can transmit many different types of signals, depending on which
interconnect fabrics are used. The right-hand side of the diagram represents how the signals can be “overlaid”
onto the same traces.
Each device bay signal connector has a 100-pin connector with 64 high-speed signal pins hard-wired
from the device bay connector to the interconnect bays. This results in 16 lanes (64 ÷ 4) to each
interconnect bay. This provides at least two lanes to each interconnect port for connectivity to LAN,
storage area network (SAN), InfiniBand, or any other interconnect type. Full-height servers occupy two
half-height device bays and therefore have up to 32 lanes available.
A single lane supports up to 10-Gb signals, depending on the protocol requirement. Each lane
provides the flexibility of 1x, 2x, or 4x connections from the server blade mezzanine cards, which
provide connectivity to the interconnect bays. The rear of the enclosure includes four interconnect bays
that can accommodate four single or two redundant interconnect modules. All interconnect modules
plug directly into these interconnect bays. Each HP BladeSystem c3000 Enclosure requires two
interconnect switches or two pass-thru modules, side-by-side, for a fully redundant configuration.
Fabric connectivity and port mapping
Each enclosure requires interconnects to provide network access for data transfer. The interconnects
reside in interconnect bays located on the rear of the enclosure (Figure 11). The server blades and
enclosure support up to three independent interconnect fabrics, such as Ethernet, Fibre Channel,
InfiniBand, and Virtual Connect modules.
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