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Philips HTS3155/78 Service Manual

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1-7

Pb(Lead) Free Solder

When soldering , be sure to use the pb free solder.

INDENTIFICATION:

Regardless of special logo (not always indicated)

one must treat all sets from

1 Jan 2005onwards, according

next rules:

Important note: In fact also products of year 2004 must

be treated in this way as long as you avoid mixing solder-

alloys (leaded/ lead-free). So best to always use SAC305

and the higher temperatures belong to this.

Due to lead-free technology some rules have to be

respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with

order code 0622 149 00106. If lead-free solder-paste

is required, please contact the manufacturer of your

solder-equipment. In general use of solder-paste

within workshops should be avoided because paste is

not easy to store and to handle.

• Use only adequate solder tools applicable for lead-

free solder alloy. The solder tool must be able

– To reach at least a solder-temperature of 400°C,

– To stabilize the adjusted temperature at the solder-

tip

– To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around

360°C – 380°C is reached and stabilized at the solder

joint. Heating-time of the solder-joint should not exceed

~ 4 sec. Avoid temperatures above 400°C otherwise

wear-out of tips will rise drastically and flux-fluid will

be destroyed. To avoid wear-out of tips switch off un-

used equipment, or reduce heat.

• Mix of lead-free solder alloy / parts with leaded solder

alloy / parts is possible but PHILIPS recommends

strongly to avoid mixed solder alloy types (leaded and

lead-free).

If one cannot avoid or does not know whether product

is lead-free, clean carefully the solder-joint from old

solder alloy and re-solder with new solder alloy

(SAC305).

• Use only original spare-parts listed in the Service-

Manuals. Not listed standard-material (commodities)

has to be purchased at external companies.

• Special information for BGA-ICs:

– Always use the 12nc-recognizable soldering

temperature profile of the specific BGA (for de-

soldering always use the lead-free temperature profile,

in case of doubt)

– Lead free BGA-ICs will be delivered in so-called ‘dry-

packaging’ (sealed pack including a silica gel pack) to

protect the IC against moisture. After opening,

dependent of MSL-level seen on indicator-label in the

bag, the BGA-IC possibly still has to be baked dry.

(MSL=Moisture Sensitivity Level). This will be

communicated via AYS-website.

Do not re-use BGAs at all.

• For sets produced before 1.1.2005 (except products

of 2004), containing leaded solder-alloy and

components, all needed spare-parts will be available

till the end of the service-period. For repair of such

sets nothing changes.

• On our website

www.atyourservice.ce.Philips.com

you find more information to:

• BGA-de-/soldering (+ baking instructions)

• Heating-profiles of BGAs and other ICs used in

Philips-sets

You will find this and more technical information

within the “magazine”, chapter “workshop news”.

For additional questions please contact your local

repair-helpdesk.