CH Tech HF4x8 Specification Sheet

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Brand: CH Tech

Category: Switch

Type: Specifications for CH Tech HF4x8

Pages: 1 (0.09 Mb)

Download CH Tech HF4x8 Specifications

CH Tech HF4x8 Specifications - Page 1
1
C&H Technologies, Inc. 445 Round Rock West Drive Round Rock, TX 78681-5012
(512) 733-2621 FAX (512) 733-2629 www.chtech.com
Configuration:
True 4x8 matrix with 4 highways
also switched to P2.
Relay Contacts:
Max. Current, Resistive Load 0.25A
Max. Voltage
DC Resistive Load 50 V
AC Resistive Load 120 V
Max. VA, Resistive Load 4 VA
Typical Operating Time
(including bounce) 1 ms
Max. Contact Resistance
Initial 0.2
End of Life 1.0
Ordering Information
Part Number: 11026000-0001
Description: HF 4x8 Switching Mod.
Application Notes: 11026005-0001
VMEbus Compliance
Complies with ANSI/IEEE Std 1014-
1987
A32/A24/A16:D16 DTB Slave
No SYSFAIL
No Interrupts
IACKIN tied to IACKOUT
BRX tied to BGX
Form Factor: Size B
Applications
Switching matrix for ATE
Signal switching for data
acquisition
Signal switching for simulation
Systems signal control in a lab or
development environment
Specifications:
Characteristic Impedance: 50
Bandwidth: 100 Mhz
Isolation: >40 db @ 100 Mhz
>60 db @ 10 Mhz
Insertion Loss: <1.0 db @ 100 Mhz
<0.2 db @ 10 Mhz
Signal Connections: BNC
Power: +5V @ 1.2 A typical
+12V @ 0.12 A typical
Relay Live Expectancy:
Rated Load Operation >3x10
6
Dry Circuit Operations >1x10
8
BITE:
Read-back capability of all relay
driver states provides system check
of entire board except for relay
contacts.
HF4x8
Switching Module
The HF4x8 is a VMEbus compatible
100 Mhz switching matrix with
comprehensive Built-in-Test
Equipment (BITE) capabilities.
Modules may be joined in tree
fashion via the top edge BNC
connectors to create 8x8, 8x16,
4x16, or 4x32 configurations (4
signal highways maximum),
maintaining the 100 Mhz bandwidth.
Modules may be connected via the
P2 connector to create 8x16, 8x24,
8x32, 8x40, etc. configurations (4
signal highways maximum at P2
with stub disconnect relays), with
some decrease in bandwidth. See
Application Notes for details.